Multi-chip LED module

Multi-Chip LED Module SEP*W***** Series

Features

· High efficiency and high output through placement of a large number of high-efficiency chips
· Realization of low thermal resistance through distributed placement of heat sources and use of superior thermal dissipation structure (6°C/W for 8 element type)
· Consistent brightness at emitting surface by means of serial connection of chips
· Drive circuit saving achieved through serial connection of chips
· Various chip configurations available for diverse applications (maximum of 10 chips, standard configuration = 8 chips)
· Hygienic because it does not attract insects due to absence of ultraviolet light


Electro-optical Characteristics

Parameter Symbol Condition MIN TYP MAX Unit
Forward DC voltage per element VF IF=20mA
Ta=25°C
  3.3   V
Reverse DC current per element IR VR=5V     10 μA
All luminous fluxes (total of all elements) SEP0WA*****1) φ for IF=20mA/element   50   lm
SEP8WA*****2)   40  
SEP6WA*****3)   30  
Peak wavelength λP IF=20mA
Ta=25°C
  468   nm
Chromaticity coordinates X
Y
IF=20mA
Ta=25°C
Refer to separate chromaticity diagram. -

*1: 10 elements
*2: 8 elements
*3: 6 elements

Chromaticity Diagram


External Dimensions


Applications

Light sources for scanners and amusement equipment, backlights for LCDs, billboards, etc., and lighting applications for outdoors (garden lights, street lights, etc.), showcases (dishes, clothing, etc.), vending machines, freezer (refrigerator) trucks, stores, etc.

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